Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP

Materials Science & Technology

HOME CONTACT

NEW: Advanced Search

MSF

>

Materials Science Forum

KEM

>

Key Engineering Materials

SSP

>

Solid State Phenomena

DDF

>

Defect and Diffusion Forum

AMM

>

Applied Mechanics and Materials

AMR

>

Advanced Materials Research

AST

>

Advances in Science and Technology

JNanoR

>

Journal of Nano Research

JBBTE

>

Journal of Biomimetics, Biomaterials, and Tissue Engineering

JMNM

>

Journal of Metastable and Nanocrystalline Materials

> @scientific.net

CONFERENCE

10/18/2009 - 10/19/2009

APCCC-15: 15. Asian-Pacific corrosion control conference

6/28/2009 - 7/3/2009

ICMAT 5

4/25/2009 - 4/28/2009

ICPMT09: 9. International Conference on Progress of Machining Technology

more...

Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP

Get the full paper by clicking here