A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing

Materials Science & Technology

HOME CONTACT

NEW: Advanced Search

MSF

>

Materials Science Forum

KEM

>

Key Engineering Materials

SSP

>

Solid State Phenomena

DDF

>

Defect and Diffusion Forum

AMM

>

Applied Mechanics and Materials

AMR

>

Advanced Materials Research

AST

>

Advances in Science and Technology

JNanoR

>

Journal of Nano Research

JBBTE

>

Journal of Biomimetics, Biomaterials, and Tissue Engineering

JMNM

>

Journal of Metastable and Nanocrystalline Materials

> @scientific.net

CONFERENCE

10/18/2009 - 10/19/2009

APCCC-15: 15. Asian-Pacific corrosion control conference

6/28/2009 - 7/3/2009

ICMAT 5

4/25/2009 - 4/28/2009

ICPMT09: 9. International Conference on Progress of Machining Technology

more...

A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing

Get the full paper by clicking here