Ultra Clean Processing of Semiconductor Surfaces VIII
Solid State Phenomena Volume 134
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p133
II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization
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143 K
]
Authors: Aseem K. Srivastava, Ke Ping Han, Mike S. Ameen, Ivan L. Berry, Stu Rounds -
p139
Effect of Dopants on the Dissolution Behavior of
Silicon Substrates in HF-Based Cleaning Solutions
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164 K
]
Authors: Salima Abu Jeriban, Ivette Guiot, Luc Bacherius, Joris Proost, Erik Sleeckx, Rita Vos, Paul W. Mertens -
p143
The Effect of Various Process Induced Damages on Wet Etching Rate Difference
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664 K
]
Authors: Hyo Geun Yoon, Sang Hyun Lee, Woo Jin Kim, Geun Min Choi, Young Wook Song -
p151
How Bubbles (Can) Clean
[
498 K
]
Authors: Claus Dieter Ohl, Rory Dijkink, Manish Arora, Detlef Lohse -
p155
Aging Phenomena in the Removal of Nano-Particles from Si Wafers
[
127 K
]
Authors: Guy Vereecke, J. Veltens, Kai Dong Xu, Atsuro Eitoku, K. Sano, Sophia Arnauts, Karine Kenis, J. Snow, Chris Vinckier, Paul W. Mertens -
p159
Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP
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2 M
]
Authors: Yi Koan Hong, Young Jae Kang, Jin Goo Park, Sang Yeob Han, Seong Kyu Yun, Bo Un Yoon, Chang Ki Hong -
p165
Particle-Substrate Interaction Forces in a Non-Polar Liquid
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368 K
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Authors: Francesca Barbagini, Wim Fyen, Jan Van Hoeymissen, Paul W. Mertens, Jan Fransaer -
p169
Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP
[
148 K
]
Authors: Silvia Armini, Ruslan Burtovyy, Igor Luzinov, Caroline M. Whelan, Karen Maex, Mansour Moinpour -
p173
Particle Deposition and Removal from Ge Wafers
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149 K
]
Authors: Sonja Sioncke, Marcel Lux, Wim Fyen, Marc Meuris, Paul W. Mertens, Antoon Theuwis -
p177
A Study of a Single-Wafer Process in Metal Contact Hole Cleaning
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1 M
]
Authors: Jae Yong Park, Jong Kook Song, Han Mil Kim, Hee Kang Cho, Tae Gyun Kim, Bong Ho Moon, Eun Su Rho, Leo Archer, Won Ho Cho
