Ultra Clean Processing of Semiconductor Surfaces VIII
Solid State Phenomena Volume 134
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p181
The Active Role of Etch Products in Particle Removal by SC-1 Solutions
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287 K
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Authors: Alexander Pfeuffer, Wolfgang Bensch, Alfred Lechner, Harald Okorn-Schmidt -
p185
New FEOL Cleaning Technology for Advanced Devices beyond 45 nm Node
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184 K
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Authors: Hiroshi Tomita, Yuji Yamada, Hidenobu Nagashima, Norio Ishikawa, Yumiko Taniguchi -
p189
In Situ Particle Removal Studies Using an Optical Particle Counter
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179 K
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Authors: D. Martin Knotter, Roy Te Brake, Michiel Enkelaar -
p193
Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic
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181 K
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Authors: Guy Vereecke, T. Veltens, Atsuro Eitoku, K. Sano, G. Doumen, Wim Fyen, Kurt Wostyn, J. Snow, Paul W. Mertens -
p197
Modeling of Shock Wave Emission during Acoustically-Driven Cavitation-Induced Cleaning Processes
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193 K
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Authors: Vincent Minsier, Joris Proost -
p201
Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes
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365 K
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Authors: Frank Holsteyns, Tom Janssens, Sophia Arnauts, Wouter Van der Putte, Vincent Minsier, Johann Brunner, Joachim Straka, Paul W. Mertens -
p205
New Brush Scrubbing Techniques for a Wafer Bevel, Apex and Edge
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269 K
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Authors: Hajime Ugajin, Hayato Iwamoto, Eiji Hide, Nobuyasu Hiraoka, Tsuyoshi Okumura -
p209
Low Si Recess on Cleaning Process by Dilute HF/SC-1 with Megasonic
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602 K
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Authors: Ji Hoon Cha, Chang Sup Mun, Dae Hyuk Kang, Woo Gwan Shim, Kun Tack Lee, Chang Ki Hong, Han Ku Cho, Joo Tae Moon -
p213
Preparation, Characterization, and Damage-Free Processing of Advanced Multiple-Gate FETs
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850 K
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Authors: Jeffrey M. Lauerhaas, Rinn Cleavelin, Wei Ze Xiong, Koki Mochizuki, Kara Sherman, Hu Cheng Lee, Brian Clappin, Thomas Schulz, Klaus Schruefer -
p217
Impact of Re-Gasified Water on Megasonic Cleaning
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234 K
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Authors: Boon Cheng Goh, Felicia Goh, Christopher Lim, Zainab Ismail, Mei Sheng Zhou
