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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

• Papers
• Abstracts

• p307 A Novel Surface Cleaning for Copper Interconnection Using Ammonium Decomposed Species Generated by Hot Wire   [ 177 K ]
  Authors: Akira Izumi, Tomoya Ueno
• p313 Improvement of Contact Clean Using Single-Wafer Clean Process for 90nm and Beyond   [ 152 K ]
  Authors: Jae Woo Nam, Andrey Zagrebelny, Roc Blumenthal, Joy Block, Miranda Duray, Brian Aegerter
• p317 Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films   [ 483 K ]
  Authors: A.M. Urbanowicz, A. Humbert, G. Mannaert, Z. Tokei, Mikhail R. Baklanov
• p321 Impact of Plasma and Diluted HF on a CoWP Material   [ 1 M ]
  Authors: Diane Rébiscoul, Lucile Broussous, N. Lopez, A. Roman, R. Kachtouli, L.G. Gosset, J. Guillan, Didier Louis, G. Passemard
• p325 Photoresist Characterization and Wet Strip after Low-k Dry Etch   [ 493 K ]
  Authors: Martine Claes, Q.T. Le, J. Keldermans, E. Kesters, Marcel Lux, A. Franquet, Guy Vereecke, Paul W. Mertens, M.M. Frank, Robert Carleer, P. Adriaensens, D. Vanderzande
• p329 Implications of the Selectiveness of Cu Chelators on Cu⁰, Cu(I)O and Cu(II)O Powders   [ 300 K ]
  Authors: Jennie Macdougall, Chris Reid, Larry McGhee
• p333 Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution   [ 148 K ]
  Authors: Diane Rébiscoul, N. Lopez, Lucile Broussous, Didier Louis, G. Passemard
• p337 Marangoni Dryer Integrated High Performance Cleaner for Cu/Low k Post Strip Clean for 45nm Technology Node and Beyond   [ 427 K ]
  Authors: Jian She Tang, Wei Lu, Bo Xi, Eli Martinez, Fred Li, Alex Ko, Craig Todd, John T.C. Lee
• p341 Effect of Pressure Pulsation on Post-Etch Photoresist Stripping on Low-k Films in Supercritical CO₂   [ 847 K ]
  Authors: H. Kiyose, K. Saito, I. Mizobata, T. Iwata, S. Hirae, Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori
• p345 Optimization of a SC CO₂ Post-Etch Cleaning for Copper Interconnections   [ 2 M ]
  Authors: Diane Rébiscoul, V. Perrut, C. Ventosa, M. Assous, Didier Louis, G. Passemard