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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

• Papers
• Abstracts

• p351 Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect   [ 1 M ]
  Authors: Han Xu, Thibaut David, Yin Xu, Vlad Tarasov, Nicolas Possémé, Didier Louis
• p355 Effect of Wafer Rotation on Photoresist Stripping in Supercritical CO₂   [ 303 K ]
  Authors: Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori, K. Saito, I. Mizobata, T. Iwata, S. Hirae
• p359 Metal Hard Mask Employed Cu/Low k Film Post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow   [ 2 M ]
  Authors: Miao Chun Lin, Mei Qi Wang, Joe Lai, Ren Huang, Cheng Ming Weng, J.H. Liao, Jian She Tang, Ching Hwa Weng, Wei Lu, Han Wen Chen, John T.C. Lee
• p363 Mechanism and Principles of Post Etch Al Cleaning with Inorganic Acids   [ 933 K ]
  Authors: Steven Verhaverbeke, Roman Gouk, Jim Papanu, Han Wen Chen
• p367 AlCu Metal Line Corrosion: A Case Study   [ 1 M ]
  Authors: Francesco Pipia, Annamaria Votta, Gloria Obetti, Enrico Bellandi, Mauro Alessandri, Thomas Nolan
• p371 Copper Surface Analysis with ToF-SIMS: Spectra Interpretation and Stability Issues   [ 163 K ]
  Authors: Chantal Trouiller, Sébastien Petitdidier, X. Ravanel, Lucile Broussous, M. Juhel, L.F.Tz. Kwakman, C. Wyon
• p375 Influence of the Process Conditions of a Polishing Rinse after CuCMP   [ 159 K ]
  Authors: Andrea Filippini, Sébastien Petitdidier, Chantal Trouiller, Alexandre Couvrat, Marie Christine Luche, Eric Sabouret
• p379 Wet Process Developments for Electrical Properties Improvement Of 3D MIM Capacitors   [ 177 K ]
  Authors: Claire Therese Richard, D. Benoit, S. Cremer, L. Dubost, B. Iteprat, M. Vincent, E. De Bock, C. Perrot, C. Rossato, M. Proust, S. Guillaumet