Paper Title:
A Model of CMP about Magnetic Fluid and its Numerical Simulations
  Abstract

Chemical mechanical polishing (CMP) is one of the most effective technologies in modern ultra-precision processing. In this paper, we consider the slurry is ferromagnetic fluid and the influence of the centrifugal force, and then obtain the equations about this slurry in CMP. The slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions, and the affects of film thickness, roll and pitch angles are also calculated.

  Info
Periodical
Chapter
Chapter 2: Simulation and Engineering Optimization
Edited by
Di Zheng, Yiqiang Wang, Yi-Min Deng, Aibing Yu and Weihua Li
Pages
333-338
DOI
10.4028/www.scientific.net/AMM.101-102.333
Citation
Y. Z. Li, X. P. Fan, Q. Y. Zheng, "A Model of CMP about Magnetic Fluid and its Numerical Simulations", Applied Mechanics and Materials, Vols. 101-102, pp. 333-338, 2012
Online since
September 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jin Quan Liu, Chao Hui Zhang, Wei Ye
Abstract:Temperature rise has two-edged influences on chemical mechanical polishing (CMP) process: temperature-rise facilitates the chemical activity...
1671
Authors: Wen Jie Zhai, Chang Xiong Liu, Pei Lian Feng
Abstract:The average Reynolds equation and average clearance equation of circular translational polishing (CTP) under the quasi-stable mixed...
264
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Dong Ming Guo, Ren Ke Kang
Abstract:Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer. The nonuniformity of...
119
Authors: Fei Yan Lou
Abstract:A three-dimensional hydrodynamic lubrication model based on lubrication theory is developed which accounts for pad roughness and slurry flow....
1213
Authors: J.X. Su, Jia Xi Du, X.L. Liu, H.N. Liu, R.K. Kang
Abstract:Chemical mechanical polishing (CMP) has become the most widely used planarization technology in the metal and hard-brittle crystal substrate...
243