Paper Title:
Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal
| Periodical | Applied Mechanics and Materials (Volumes 101 - 102) |
|---|---|
| Main Theme | Advances in Engineering Design and Optimization II |
| Edited by | Di Zheng, Yiqiang Wang, Yi-Min Deng, Aibing Yu and Weihua Li |
| Pages | 950-953 |
| DOI | 10.4028/www.scientific.net/AMM.101-102.950 |
| Citation | Yu Fei Gao et al., 2011, Applied Mechanics and Materials, 101-102, 950 |
| Online since | September, 2011 |
| Authors | Yu Fei Gao, Pei Qi Ge |
| Keywords | Grit Cut Depth, KDP Crystal, Process Parameter, Wire Saw |
| Price | US$ 28,- |
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Abstract
A wire-saw cut KDP crystal geometrical model was founded and a mathematical model was established to calculate the grit average cut depth, based on indentation fracture mechanics theory(IFMT). The relationship between the grit cut depth and wire saw process parameter was analyzed theoretically. The research results indicate that there exists an approximate monotone increasing non-linear correlation between grit average cut depth and the ratio i value of crystal feed speed and wire speed. By increasing the wire speed and crystal feed speed accordantly, the value of i can be maintained invariable, however, this way can simultaneously bring higher machined surface quality and machining efficiency.
