Paper Title:
Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal
  Abstract

A wire-saw cut KDP crystal geometrical model was founded and a mathematical model was established to calculate the grit average cut depth, based on indentation fracture mechanics theory(IFMT). The relationship between the grit cut depth and wire saw process parameter was analyzed theoretically. The research results indicate that there exists an approximate monotone increasing non-linear correlation between grit average cut depth and the ratio i value of crystal feed speed and wire speed. By increasing the wire speed and crystal feed speed accordantly, the value of i can be maintained invariable, however, this way can simultaneously bring higher machined surface quality and machining efficiency.

  Info
Periodical
Chapter
Chapter 5: Advanced Machining and Materials Processing Technology
Edited by
Di Zheng, Yiqiang Wang, Yi-Min Deng, Aibing Yu and Weihua Li
Pages
950-953
DOI
10.4028/www.scientific.net/AMM.101-102.950
Citation
Y. F. Gao, P. Q. Ge, "Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal", Applied Mechanics and Materials, Vols. 101-102, pp. 950-953, 2012
Online since
September 2011
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Price
$32.00
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