Paper Title:
Mechanical Strength Characterization for Silicon-to-Silicon Direct Bonding
  Abstract

In this paper, silicon direct bonding was performed by two different cleaning processes, and the bonding quality was obtained by tensile test and IR test. For (100) P-type double side polished wafer, the optimum process condition was established with respect to the results of two different cleaning processes. The cleaning process of NH3•H2O/H2O2/H2O (Standard Cleaning 1, SC1) after the H2SO4/H2O2 (piranha solution) was found to be better suited for high bonding quality. The bonding strength of the SC1-cleaned samples is about 5.4 MPa with partially crack but no more than 0.7 MPa for the only piranha solution cleaned samples.

  Info
Periodical
Chapter
Chapter 7: Building Materials
Edited by
Paul P. Lin and Chunliang Zhang
Pages
1662-1665
DOI
10.4028/www.scientific.net/AMM.105-107.1662
Citation
X. Yan, Y. L. Zhao, H. S. San, Y. X. Yu, X. Y. Chen, "Mechanical Strength Characterization for Silicon-to-Silicon Direct Bonding", Applied Mechanics and Materials, Vols. 105-107, pp. 1662-1665, 2012
Online since
September 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: K. Rajanna, S. Tanaka, Toshio Itoh, Masayoshi Esashi
1527
Authors: Akio Nishimoto, Katsuya Akamatsu
Abstract:Pulsed electric current sintering (PECS) was applied to the bonding of W (tungsten) to Cu (copper) using Nb or Ni powder as an intermediate...
289
Authors: Yu Xin Li, De Yong Chen, Jun Bo Wang
Chapter 1: Micro/Nano Transducer/Acutar/Robot
Abstract:This paper presents a method of low temperature wafer level adhesive bonding using non-photosensitive bisbenzocyclobutene (BCB) from Dow Co...
55
Authors: Don Dussault, F. Fournel, V. Dragoi
Chapter 8: Cleaning for 3D Applications
Abstract:Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that...
269
Authors: Chun Yu Wang, Qing Wang, Han Zhu Li, Xiao Zhi Ji, Zhi Long Kang
Chapter 10: Steel, Alloys and Coating
Abstract:Keywords: Electroless plating Ni, CeO2, Micro-connection pad, Wire bonding Abstract. It is Ni/CeO2 coatings that have been prepared on SiC/Al...
1925