Paper Title:
Study on High Thermal Conductive BN/Epoxy Resin Composites
  Abstract

In contemporary electronic technology era, the volume of electronic equipment and printed circuit board reduced so dramatically that the requirements of heat dissipation and insulation increase thereafter. In this research, γ-aminopropyltriethoxysilane (KH550)-treated boron nitride (BN) powder was used as a filler to modify epoxy composites. Effects of the BN particle size and concentration on the thermal conductivity of composites were investigated. SEM image showed the treated BN filler dispersed well in the composite matrix. Moreover, the thermal conductivity was enhanced as the BN concentration was increased. Similar phenomenon was also observed when the filler particle size was reduced. Results indicated that with increasing amount of BN addition, the composites’ thermal conductivity showed a nearly linear increase. When the mass fraction of BN was 30% and its particle size was 220 nm, the thermal conductivity reached 3.4 W/(m•k), which was 17 times as high as that of pure EP resin.

  Info
Periodical
Chapter
Chapter 7: Building Materials
Edited by
Paul P. Lin and Chunliang Zhang
Pages
1751-1754
DOI
10.4028/www.scientific.net/AMM.105-107.1751
Citation
H. Wang, P. Chen, J. Sun, X. J. Kuang, Z. K. Yao, "Study on High Thermal Conductive BN/Epoxy Resin Composites", Applied Mechanics and Materials, Vols. 105-107, pp. 1751-1754, 2012
Online since
September 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ming Liang Luo, Qing Zhi Wen, Hong Jian Liu, Jia Lin Liu
Abstract:Sulfonated-polyethersulfone/TiO2 (SPES/TiO2) nanoparticle composites with different TiO2 content were prepared by a sol-gel process. These...
663
Authors: Hai Yun Jin, Hui Cheng Shi, Bo He, Nai Kui Gao, Zeng Ren Peng
Abstract:AlN filled epoxy composites were fabricated. The microstructure of composites was observed by SEM. The thermal conductivity was also...
460
Authors: Xian Liang Zhou, Duo Sheng Li, Ai Hua Zou, Xiao Zhen Hua, Zhi Guo Ye, Qing Jun Chen
New Functional Materials
Abstract:SiCp/Al composites were fabricated by ceramic mold freedom infiltration and pressureless infiltration, respectively. The microstructure and...
658
Authors: Xin Fan
Chapter 3: Micro/Nano Materials
Abstract:Blends of Poly(L-lactide) (PLLA) and nano-SiO2 powder were prepared via solution mixing. Effect of nano-SiO2 particles on the crystallinity...
367
Authors: Mi Dan Li, Yao Lu, Lu Lu Feng, Huan Niu, Ya Wen Kong
Chapter 2: Research on Materials,Mechanics and Technologies
Abstract:Composites made from phenolic resin are filled with conductive filler mixtures containing copper powders, natural graphite powders and carbon...
120