Paper Title:
The Spectral Analysis of Vibration Signal on Wire Bonder
  Abstract

This paper discusses the method of vibration spectral analysis to get characters of wire bonder, based on the work principle and character of wire bonder. Vibration signals are acquired by vibration sensors, and Dewetron data-acquisition system has been used for the data analysis to get spectrum. From the spectrum of vibration signal, the main frequency and corresponding amplitude have been acquired. Amplitude of main frequency at different working condition on the same machine is compared by figures. The results show that machine 1&2 has almost the same vibration at the workbench, although machine 2 has bigger local vibration than machine 1. It can be concluded that the much bigger local vibration has less effect on the quality of parts in this case.

  Info
Periodical
Chapter
Chapter 1: Vibration Engineering
Edited by
Paul P. Lin and Chunliang Zhang
Pages
263-266
DOI
10.4028/www.scientific.net/AMM.105-107.263
Citation
X. J. Lu, Z. G. Wang, "The Spectral Analysis of Vibration Signal on Wire Bonder", Applied Mechanics and Materials, Vols. 105-107, pp. 263-266, 2012
Online since
September 2011
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Price
$32.00
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