Paper Title:
Vibration Fatigue Analysis of the Solder Connector
  Abstract

With the increasing problems of fatigue failure of PCB in aeronautic and astronautic electronic chassis, the paper proposes a life prediction method of the solder connector based on physics of failure by simulation and physical test. The virtual modal and random vibration response of the box should be solved by finite element method in the ANSYS software, and these results have been verified by modal test and random vibration test. While the structure parameter and the environment stress of the box, the results of the simulation as the input of the vibration fatigue physics of failure model, the life of solder connector could be computed. There is a comparison between results from the CalcePWA software and it from physics of failure model and simulation.

  Info
Periodical
Chapter
Chapter 1: Vibration Engineering
Edited by
Paul P. Lin and Chunliang Zhang
Pages
294-298
DOI
10.4028/www.scientific.net/AMM.105-107.294
Citation
X. X. Guo, C. R. Li, L. T. Liu, "Vibration Fatigue Analysis of the Solder Connector", Applied Mechanics and Materials, Vols. 105-107, pp. 294-298, 2012
Online since
September 2011
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Price
$32.00
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