Paper Title:
Work around Moore’s Law: Current and next Generation Technologies
  Abstract

Interconnect dimensions and CMOS transistor feature size approach their physical limits, therefore scaling will no longer play an important role in performance improvement. So, instead of trying to improve the performance of traditional CMOS circuits, integration of multiple technologies and different components in a heterogeneous system that is high performance will be introduced “moore than more” and CMOS replacement”beyond CMOS” will be explored. This paper focuses on Technology level trends where it presents “More Moore”:New Architectures (SOI, FinFET, Twin-Well),”More Moore” :New Materials (High-K, Metal Gate, Strained-Si) ,”More than Moore”:New Interconnects Schemes (3D, NoC, Optical, Wireless), and ”Beyond CMOS” :New Devices (Molecular Computer, Biological computer, Quantum Computer) .

  Info
Periodical
Chapter
Chapter 15: Meso/Micro Manufacturing Equipment and Processes
Edited by
Wu Fan
Pages
3278-3283
DOI
10.4028/www.scientific.net/AMM.110-116.3278
Citation
K. S. Mohamed, "Work around Moore’s Law: Current and next Generation Technologies", Applied Mechanics and Materials, Vols. 110-116, pp. 3278-3283, 2012
Online since
October 2011
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Price
$32.00
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