Paper Title:
Design and Optimization of the Deposition Baffle Shape for Magnetron Sputtering
  Abstract

This resistance by tests to simulate the sputtering thickness distribution and the relative value, we try to reduce the degree of uneven thickness by designing baffle shape for the coating equipment. In view of the structural characteristics of the device and the deposition of complex principles, theory and practice there are still some gaps, according to the measured data (resistance value) to be constantly revised to optimize and baffle design to achieve greater uniformity of product thickness. For example, to meet the resistivity greater than or equal 9.6 Ω and the average transmittance above 80%, TiO2/Ag/TiO2 film fully met the requirements of practical applications by applying improved baffle. Concluding remarks are stated at the end of the abstract text. Based on the use of a simple baffle design and improvement, we had achieved good results in mastering the sputtering parameters.

  Info
Periodical
Chapter
Chapter 8: Material Processing Technology
Edited by
Huixuan Zhang, Ye Han, Fuxiao Chen and Jiuba Wen
Pages
1580-1583
DOI
10.4028/www.scientific.net/AMM.117-119.1580
Citation
H. F. Chen, J. H. Zhu, Y. Z. Sun, M. G. Qian, "Design and Optimization of the Deposition Baffle Shape for Magnetron Sputtering", Applied Mechanics and Materials, Vols. 117-119, pp. 1580-1583, 2012
Online since
October 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yu Peng Xu, Li Jie Cui, Xin Xin Ren, Wei Ge, Wei Gang Lin
Chapter 3: Mechanics Engineering and Applied Mechanics
Abstract:Understanding the heat transfer among particles with uneven temperature distribution is a key to powder processing. In this work, the...
908
Authors: Zheng Jia, Sheng Tao Zhang, Dong Liu, Wei He, Huan Wu Zhang
Chapter 1: Material Science Technology
Abstract:The uniformity of plating copper layer thickness and film clip rate is one of the important indicator of PCB’s quality, which will affect...
158