Paper Title:
The Force Theoretical Analysis and Experiment for Wire Saw with UVM Cutting SiC Monocrystal
  Abstract

Wire saw has a unique benefit in cutting precious material like SiC, Si monocrystal and gem etc since the cutting force is small, and the kerf loss is low and so on. In the common wire saw cutting process, the production efficiency is low, the wire saw wear is dramatic severe, the surface roughness of part is not expected and collapses flaws often occur on wafer as well, all those problems have a heavy effectiveness on wafer quality. In order to solve those problem, the ultrasonic vibration machining (UVM) has been applied to cut the hard & brittle materials which has a significant improvement on surface integrity of wafer and increasingly apply to nonconductive materials cutting, such as glass, ceramics, Si, gem and so on. In this paper, the cutting force for SiC monocrystal wafer by wire saw with UVM is studied, the mathematic model of cutting force for wire saw with UVM is discussed and the Fourier series expansion is used to solve the equation of cutting force. The experiments that the process parameters influence on the cutting force by common wire saw cutting and wire saw with UVM are conducted, respectively. The result show that wire saw with UVM can significantly decrease the cutting force, which is consistent with the theoretical analysis.

  Info
Periodical
Chapter
Chapter 8: Material Processing Technology
Edited by
Huixuan Zhang, Ye Han, Fuxiao Chen and Jiuba Wen
Pages
1728-1735
DOI
10.4028/www.scientific.net/AMM.117-119.1728
Citation
S. J. Li, J. Zhang, B. Wan, Y. Li, "The Force Theoretical Analysis and Experiment for Wire Saw with UVM Cutting SiC Monocrystal", Applied Mechanics and Materials, Vols. 117-119, pp. 1728-1735, 2012
Online since
October 2011
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Price
$32.00
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