Paper Title:
Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method
  Abstract

By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.

  Info
Periodical
Chapter
Chapter 2: Dynamics and Vibration
Edited by
Huixuan Zhang, Ye Han, Fuxiao Chen and Jiuba Wen
Pages
195-200
DOI
10.4028/www.scientific.net/AMM.117-119.195
Citation
Q. Z. Zhang, G. Wu, Z. Y. Pang, J. Z. Chen, G. H. Li, K. Bi, "Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method", Applied Mechanics and Materials, Vols. 117-119, pp. 195-200, 2012
Online since
October 2011
Export
Price
$32.00
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