Paper Title:
Using an Intelligent Approach to Recognize a Wafer Bin Map Pattern
  Abstract

To decrease cost, semiconductor manufacturing companies always aim for yield enhancement. The analysis of Wafer Bin Maps (WBMs) is important for yield improvement. Real data sets are collected from a famous semiconductor manufacturing company to verify the presented method. Four types of WBMs patterns, center, edge, local, and ring types are selected for verification. Experimental results showed that with adequate parameter settings, the method can successfully recognize the pattern types and distinguish between random and systematic WBMs. There were 17 testing samples, and 16 of them were recognized correctly. The accuracy was 94.12%.

  Info
Periodical
Chapter
Chapter 3: Advanced Manufacturing Technology (1)
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
1344-1346
DOI
10.4028/www.scientific.net/AMM.121-126.1344
Citation
S. F. Liu, F. L. Chen, A. S. Chung, "Using an Intelligent Approach to Recognize a Wafer Bin Map Pattern", Applied Mechanics and Materials, Vols. 121-126, pp. 1344-1346, 2012
Online since
October 2011
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Price
$32.00
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