Paper Title:
Experimental Investigation on the Scribing of Sapphire Using UV Laser
  Abstract

Sapphire is an important wide bandgap semiconductor material for developing UV/blue optoelectronic devices, however because of its high hardness and chemical stability; it is mechanically and chemically difficult machine. In this paper, the scribing of sapphire by UV laser pulses is investigated under various conditions of pulse energies, scanning speed and repetition rate. The quality and morphology of the laser ablation of sapphire surface are evaluated by scanning electron microscopy. The mechanism of UV laser ablation of sapphire is discussed. The formation of grooves with high aspect ratio and good surface quality is achieved by selecting appropriate laser parameters. Scribing by pulsed UV laser therefore provide a new approach in the development of sapphire-based devices.

  Info
Periodical
Chapter
Chapter 1: Materials Science and Engineering
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
147-151
DOI
10.4028/www.scientific.net/AMM.121-126.147
Citation
M. L. Wang, Y. Wang, L. Qin, J. Guan, "Experimental Investigation on the Scribing of Sapphire Using UV Laser", Applied Mechanics and Materials, Vols. 121-126, pp. 147-151, 2012
Online since
October 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Zhen Bing Cai, Min Hao Zhu, Xiu Zhou Lin, Ji Liang Mo, Zhong Rong Zhou
Abstract:Nickel base Ni60 and cobalt base Co-Cr-W coatings were prepared on substrate of refractory alloy steel 4Cr14NiW2Mo by laser-cladding...
878
Authors: Pai Shan Pa
Abstract:The current study using ultrasonic energy transmitted into the electrolyte to assist in discharging of electrolytic product and cuttings out...
295
Authors: Keishi Yamaguchi, Mutsumi Touge, Takayuki Nakano, Junji Watanabe
Abstract:Silicon carbide (SiC) single crystal has many advantages comparing with silicon single crystal, such as wide band-gap, hardness and various...
282
Authors: Akira Nakajima, Yosuke Tateishi, Hiroshi Murakami, Hidetomo Takahashi, Michiharu Ota, Ryoji Kosugi, Takeshi Mitani, Shin Ichi Nishizawa, Hiromichi Ohashi
Chapter III: Processing of SiC
Abstract:A novel dicing technology that utilizes femtosecond pulsed lasers (FSPLs) are demonstrated as a high-speed and cost-effective dicing process...
524