Paper Title:
On-Line Inspection of Adhesive Bond Discrepancies with Dynamic Electrode Displacement Method
  Abstract

Adhesive bonding technology has become one effective joining technology instead of the traditional spot-welding especially for AHSS materials. But Adhesive bond quality inspection method is limited to the mechanical performance tests such as tensile-shear test recently and it’s time-consuming and unpractical. So a reliable and practical method for on-line identifying different bond discrepancies and assessing the bond quality is necessary in industry. Based on the thermal expansion electrode displacement mechanism during weld-bonding process, the dynamic electrode displacement method could be applied for differentiating adhesive bond discrepancies effectively through acquiring and analyzing the dynamic electrode displacement signal curves during weld-bonding process from laser displacement sensors installed onto the welding gun. Lots of experiments and analysis showed that this method is basically feasible, that is, it could identify different adhesive bond discrepancies qualitatively and accurately. So it has a good potential especially applied in production line.

  Info
Periodical
Chapter
Chapter 3: Advanced Manufacturing Technology (1)
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
1530-1534
DOI
10.4028/www.scientific.net/AMM.121-126.1530
Citation
X. Zhao, P.C. Wang, Y. S. Zhang, G. L. Chen, X. M. Lai, "On-Line Inspection of Adhesive Bond Discrepancies with Dynamic Electrode Displacement Method", Applied Mechanics and Materials, Vols. 121-126, pp. 1530-1534, 2012
Online since
October 2011
Export
Price
$32.00
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