Paper Title:

Bond Strength Analysis among Layers of Grinding Wheel

Periodical Applied Mechanics and Materials (Volumes 121 - 126)
Main Theme Frontiers of Manufacturing and Design Science II
Edited by Dongye Sun, Wen-Pei Sung and Ran Chen
Pages 38-42
DOI 10.4028/www.scientific.net/AMM.121-126.38
Citation Wei Peng et al., 2011, Applied Mechanics and Materials, 121-126, 38
Online since October, 2011
Authors Wei Peng, Chun Yan Yao, Xue Feng Xu
Keywords Bond Strength among Layers, Grinding Wheel, Photosensitive Resin
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Abstract

A novel technology is studied in this paper to make photosensitive resin grinding wheel based on layered manufacturing technology. The bond strength among resin layers is analyzed. An effective measure is proposed to improve the bond strength among resin layers of the grinding wheel. We add magnetic abrasive particles into the liquid resin to get rough surface and increase contact area by action of magnetic force. Some experiments are curried out for testing shear strength of resin with magnetic abrasive under different conditions. Results show that this method had a significant effect in improving the bond strength among layers of new grinding wheel.