Paper Title:
A Novel Low Temperature Method to Make a Wireless Accelerometer
  Abstract

This research proposes a novel low temperature manufacturing method to make a wireless accelerometer on a flexible substrate. The substrate deposition temperature is 100°C without causing any strain and stress problem. Since the thermal conductivity of the traditional Si is 1.48 W/ (cm-K), which is 25 times of the flexible substrate, i.e. 0.06-0.0017 W/ (cm-K), thus the power leakage through the substrate can be saved by the new design. The key technology is to integrate a thermal bubble accelerometer and a wireless RFID antenna on the same substrate, such that the accelerometer is very convenient for fabrication and usage. In this paper the heaters and the thermal piles are directly adhering on the substrate surface without the traditional floating structure. Thus the structure is much simpler and cheaper for manufacturing, and much more reliable in large acceleration impact condition without broken. Furthermore, the molecular weight of xenon gas (131.29 g/mol) is much larger than carbon dioxide (44.01 g/mol), thus the performance of the accelerometer will be increased. In addition, the shape of the chamber is changed as a semi-cylindrical one instead of the conventional rectangular type. The average sensitivity is increased by 15%. In addition, if one applies only xenon gas but keeping the rectangular chamber, then the response speed can be increased by 23%. Moreover, if one applies both Xe and the semi-cylindrical chamber, then the response speed can be increased by 43%.

  Info
Periodical
Chapter
Chapter 2: Advanced Design Science (1)
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
652-661
DOI
10.4028/www.scientific.net/AMM.121-126.652
Citation
J. M. Lin, P. K. Chang, C. H. Lin, Q. K. Zhang, "A Novel Low Temperature Method to Make a Wireless Accelerometer", Applied Mechanics and Materials, Vols. 121-126, pp. 652-661, 2012
Online since
October 2011
Export
Price
$35.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yan Liu, Yu Long Zhao, Lu Sun
Abstract:In this paper, a MEMS (micro-electro-mechanical system) accelerometer has been developed utilizing piezoresistive sensing elements for...
1305
Authors: Mei Liu, J. Zhu, Min Zhuo, Jing Wu, Shi Xing Jia
Abstract:We report our efforts towards designing and fabricating capacitive microaccelerometers with flat bottom surfaces free from the notching...
108
Authors: Xiao Gang Li, Yong Mei, Wen Gang Huang, Zheng Yuan Zhang, Jian Gen Li, Zhi Cheng Feng
Abstract:A monolithic MEMS accelerometer process was established. This process successfully combines our standard BiCMOS technology and MEMS surface...
70
Authors: M.S. Khan, A. Iqbal, S.A. Bazaz, M. Abid
Chapter 22: Mechanical and Electronic Engineering Control
Abstract:In this paper, we present the design verification of PolyMUMPs based monolithic tri-axis MEMS capacitive accelerometer. The physical level...
4625
Authors: Jium Ming Lin, Chien Chow Liaw, Wen Chen Luo, Cheng Hung Lin
Chapter 4: Mechatronics, Automation and Control
Abstract:Four novel ideas are proposed in this paper to integrate an active RFID tag with thermal convection angular accelerometer on an engineering...
1207