Paper Title:
Numerical Analysis on Thermal and Stress Coupling of Soil Subgrade
  Abstract

This paper focuses on the situation of stress, strain and displacement of subgrade under the action of temperature and load. Carry out numerical simulation for strain problem of normal subgrade plane and compare the numerical results of stress field and displacement field to the analysis results obtained from predecessor, we can find that the distribution of every value is in conformity to its variation trend. The variation of stress and displacement shall be most violent at the top surface of subgrade, thus the effect of temperature and load on stress and displacement will decrease as the depth increases. Moreover, the capacity of calculation and visualization for program is developed greatly, which can supply beneficial assistance to engineering design and appliance.

  Info
Periodical
Edited by
Honghua Tan
Pages
107-111
DOI
10.4028/www.scientific.net/AMM.29-32.107
Citation
Z. W. Zhu, J. G. Ning, "Numerical Analysis on Thermal and Stress Coupling of Soil Subgrade", Applied Mechanics and Materials, Vols. 29-32, pp. 107-111, 2010
Online since
August 2010
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Price
$32.00
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