Paper Title:

Tensile Testing of MEMS Materials at High Temperatures

Periodical Applied Mechanics and Materials (Volumes 3 - 4)
Main Theme Advances in Experimental Mechanics IV
Edited by J.M. Dulieu-Barton and S. Quinn
Pages 59-64
DOI 10.4028/www.scientific.net/AMM.3-4.59
Citation William N. Sharpe, 2006, Applied Mechanics and Materials, 3-4, 59
Online since August, 2006
Authors William N. Sharpe
Keywords Fracture Strength, High Temperature, Interferometry, Micro-Electromechanical System (MEMS), Microsystems, Nickel Ni, Poly-Silicon, Silicon Carbide (SiC), Stress-Strain Curve
Price US$ 28,-
Article Preview
View full size
Abstract

This paper presents three kinds of high-temperature test methods for three different materials along with the results. Resistively heated polysilicon film 3.5 micron thick shows ductile behavior at 500°C. Resistively heated nickel 200 microns thick shows decreasing strength at 400°C. Furnace heated silicon carbide 200 microns thick maintains its strength at 1000°C. Strain is measured by laser-based interferometry in the first two cases to obtain complete stress-strain curves, while force-displacement is measured in the third case.