Tensile Testing of MEMS Materials at High Temperatures
| Periodical | Applied Mechanics and Materials (Volumes 3 - 4) |
|---|---|
| Main Theme | Advances in Experimental Mechanics IV |
| Edited by | J.M. Dulieu-Barton and S. Quinn |
| Pages | 59-64 |
| DOI | 10.4028/www.scientific.net/AMM.3-4.59 |
| Citation | William N. Sharpe, 2006, Applied Mechanics and Materials, 3-4, 59 |
| Online since | August, 2006 |
| Authors | William N. Sharpe |
| Keywords | Fracture Strength, High Temperature, Interferometry, Micro-Electromechanical System (MEMS), Microsystems, Nickel Ni, Poly-Silicon, Silicon Carbide (SiC), Stress-Strain Curve |
| Price | US$ 28,- |
This paper presents three kinds of high-temperature test methods for three different materials along with the results. Resistively heated polysilicon film 3.5 micron thick shows ductile behavior at 500°C. Resistively heated nickel 200 microns thick shows decreasing strength at 400°C. Furnace heated silicon carbide 200 microns thick maintains its strength at 1000°C. Strain is measured by laser-based interferometry in the first two cases to obtain complete stress-strain curves, while force-displacement is measured in the third case.