Paper Title:
Tensile Testing of MEMS Materials at High Temperatures
  Abstract

This paper presents three kinds of high-temperature test methods for three different materials along with the results. Resistively heated polysilicon film 3.5 micron thick shows ductile behavior at 500°C. Resistively heated nickel 200 microns thick shows decreasing strength at 400°C. Furnace heated silicon carbide 200 microns thick maintains its strength at 1000°C. Strain is measured by laser-based interferometry in the first two cases to obtain complete stress-strain curves, while force-displacement is measured in the third case.

  Info
Periodical
Edited by
J.M. Dulieu-Barton and S. Quinn
Pages
59-64
DOI
10.4028/www.scientific.net/AMM.3-4.59
Citation
W. N. Sharpe, "Tensile Testing of MEMS Materials at High Temperatures", Applied Mechanics and Materials, Vols. 3-4, pp. 59-64, 2005
Online since
August 2006
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