Paper Title:
Finite Element Modal Analysis of the Quick Positioning System of Wire Bonders
  Abstract

The positioning system with high acceleration and high precision determines the speed and quality of bonding, which is the core component in a wire bonder, and influences the cost and reliability of the chip. The mode characteristics of the high acceleration and high precision positioning system were analyzed using ABAQUS. The results show that the system has different vibration characteristics in different resonance mode, and also has the features of mode denseness and complicated vibration mode.

  Info
Periodical
Edited by
Shengyi Li, Yingchun Liu, Rongbo Zhu, Hongguang Li, Wensi Ding
Pages
1840-1844
DOI
10.4028/www.scientific.net/AMM.34-35.1840
Citation
Q. Bai, K. X. Wei, S. S. Zhu, "Finite Element Modal Analysis of the Quick Positioning System of Wire Bonders", Applied Mechanics and Materials, Vols. 34-35, pp. 1840-1844, 2010
Online since
October 2010
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Price
$32.00
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