Paper Title:
Preparation of Silica-Based Alkaline Slurry and its Application on Chemical Mechanical Polishing of Hard Disk Substrates
  Abstract

Chemical mechanical polishing (CMP) is the effective technology which obtains high accuracy surface of hard disk substrate with nickel-phosphorus (Ni-P) coating. The slurry is significant factor in hard disk substrate CMP. Colloidal silica-based alkaline slurry was prepared based on negative pressure vortex method. The effects of slurry parameters such as abrasive concentration, organic alkali concentration and oxidant concentration on material removal rate and surface characteristics were investigated. The experimental result indicated that the abrasive concentration was 20wt%, the slurry pH value was 11.2, the oxidant concentration was 15ml/L, improved surface roughness and polishing efficiency of hard disk substrates, a smooth surface was obtained and micro scratches could hardly be observed.

  Info
Periodical
Edited by
Ran Chen
Pages
3067-3071
DOI
10.4028/www.scientific.net/AMM.44-47.3067
Citation
S. L. Wang, Z. X. Li, H. L. Mu, Y. Tian, L. B. Yang, "Preparation of Silica-Based Alkaline Slurry and its Application on Chemical Mechanical Polishing of Hard Disk Substrates", Applied Mechanics and Materials, Vols. 44-47, pp. 3067-3071, 2011
Online since
December 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jian Xiu Su, Jia Xi Du, Xing Long Liu, Hai Na Liu
Abstract:SiC crystal substrate has been widely used in the area of microelectronics, photonics and new materials, such as semiconductor lighting,...
250
Authors: Juan Wang, Ru Wang, Guo Dong Chen
Chapter 1: Materials and Technologies in the Scale of Micro and Nano
Abstract:At present, the chemical mechanical polishing is the only means for global planarization of an integrated circuit. After the node of the...
352