Paper Title:
Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process
  Abstract

With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

  Info
Periodical
Edited by
Ran Chen
Pages
992-996
DOI
10.4028/www.scientific.net/AMM.44-47.992
Citation
L. Zhang, G. Q. Zhao, H. P. Li, "Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process", Applied Mechanics and Materials, Vols. 44-47, pp. 992-996, 2011
Online since
December 2010
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