Paper Title:
Study on the Modification of Polishing Putty by Inorganic Filler
  Abstract

In order to decrease the cost of polishing putty, the interrelations between talcum powder as the filler and KH550, KH560, or silane compound coupler were investigated by atomic force microscopy (AFM) and Fourier transform infrared spectrum (FTIR). It was proved that the effect of Modification of KH560 coupler is the best.

  Info
Periodical
Edited by
Shaobo Zhong, Yimin Cheng and Xilong Qu
Pages
780-784
DOI
10.4028/www.scientific.net/AMM.50-51.780
Citation
C. B. Bi, "Study on the Modification of Polishing Putty by Inorganic Filler", Applied Mechanics and Materials, Vols. 50-51, pp. 780-784, 2011
Online since
February 2011
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