Dynamic Characteristics of a Jetting Dispenser for Wafer Die Marking

Ink marking is a key process for die sorting of IC wafer manufacturing. Intensive production of wafer is urging the inkers for more rapid and more stable ink marking performance on surface of defective wafer dies safely. In this paper, a non-contact jetting dispenser is introduced to the wafer die marking. After presenting the mathematical description of dynamic fluid for 2-phase flow, numerical simulations are launched to reveal the characteristics of droplet generation and key factors are discussed. A jetting dispenser is developed and experimental results are analyzed. According to the simulative results and the dotting performance shown in experiments, the non-contact jetting dispenser is capable for wafer die marking in dotting efficiency and stability.