Paper Title:
Investigation on the Electronic Components High Temperature Alarm in High Computer Density Internet Data Centers
  Abstract

This paper analyzes the phenomenal essence of the electronic components high temperature alarm in high computer density internet data center and the effect of controllable variables of microthermal environment around the computer racks, presents the risk index of electronic components high temperature alarm, i.e., unmatch ratio; carries out the onsite investigation on the situation of air distribution of two internet data centers in Xi’an city, and evaluates the probability of emerging the high temperature alarm, finally puts forward the suggestions of improving air distribution pattern.

  Info
Periodical
Edited by
Zhou Mark
Pages
354-357
DOI
10.4028/www.scientific.net/AMM.52-54.354
Citation
Z. W. Wang, L. Chen, X. Jing, L. P. Han, "Investigation on the Electronic Components High Temperature Alarm in High Computer Density Internet Data Centers", Applied Mechanics and Materials, Vols. 52-54, pp. 354-357, 2011
Online since
March 2011
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