Paper Title:
Through-Hole Drilling of Glass Plate Using Electroplated Diamond Tool
  Abstract

Hard and brittle materials such as ceramics and glass are not only difficult-to-machine but also occur easily cracks at the exit surface in through-hole drilling. This paper deals with through-hole drilling of glass plate for plasma display panel using an electroplated abrasive grain tool in order to find out drilling conditions for smaller cracks, higher drilling efficiency and longer tool life. In particular, the influence of the crack in two kinds of abrasive grain is examined. The main conclusions obtained in this study are as follows. The crack in diamond grain tool is smaller than that in CBN grain tool. Moreover, the tool life of diamond grain tool is longer than that of CBN grain tool. Adhered volume of chip increases with drilling numbers, so the crack size and the thrust force increases. The washing of tool is required in order to restrain crack and force.

  Info
Periodical
Edited by
Zhou Mark
Pages
384-388
DOI
10.4028/www.scientific.net/AMM.52-54.384
Citation
A. Mizobuchi, H. Ogawa, "Through-Hole Drilling of Glass Plate Using Electroplated Diamond Tool", Applied Mechanics and Materials, Vols. 52-54, pp. 384-388, 2011
Online since
March 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Xiao Yan Xiong, Miao Zhang, Xiao Ping Li, Shao Juan Yu
Abstract:Based on chaotic characteristics in vertical direction of vibrating screen sides, nonlinear methods were proposed to diagnose crack of...
1258
Authors: Ying Lin Li, Li Hui Cao, Lian He Yang
Abstract:Weft knitted pattern design is one of the most important compositions of textile CAD. Traditional pattern design has a higher request on...
576
Authors: Yong Hua Zhang, Jian Hui He, Guo Qing Zhang
Abstract:This paper aims to understand influence of the obliquity of fin ray on its motion performance. An environment-friendly propulsion system...
267
Authors: Ioana Pintilie, Francesco Moscatelli, Roberta Nipoti, Antonella Poggi, Sandro Solmi, Lars S. Løvlie, Bengt G. Svensson
Abstract:The effect of nitrogen (N) introduced by ion implantation at the SiO2/4H-SiC interface on the capacitance of the MOS capacitors is...
326
Authors: Yi Mei, Fang Ping Wang, Qiao Ying Liu, Yu Tao Mao
Abstract:To solve the thermal deformation caused by thermal load of heavy machinery gearbox, it is established that coupled analysis model to carry...
651