Paper Title:
Analysis of Interface Stress of Sn3.5Ag0.75Cu Solder under Temperature Cycle QFP Device
  Abstract

Using elastoplastic finite element method study the interface stress distribution of Sn3.5Ag0.75Cu lead-free solder at different temperatures and different strain rate. Numerical analysis results show that: when strain-rate is identical, as the temperature rises, the interface stress increased rapidly of Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites, from 11 °C when 2.6MPa rose to 90 °C in 49.7MPa, so the temperature is very large have effects of the interface stress of the lead-free solder and the substrate binding sites; when the temperature is constant, as the strain rate increases, Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites of the interface stress showed a slight increase, from 0.005% / S when the 49.47MPa rose to 0.005% / S when the 50.08MPa, so strain rate on lead-free solder and the substrate binding sites of the interface stress effect is very small, indicating Sn3 .5Ag0.75Cu lead-free solder has strong rate-independent nature.

  Info
Periodical
Edited by
Qi Luo
Pages
1468-1472
DOI
10.4028/www.scientific.net/AMM.55-57.1468
Citation
Z. Li, C. P. Zhang, M. R. Zhao, H. J. Jin, "Analysis of Interface Stress of Sn3.5Ag0.75Cu Solder under Temperature Cycle QFP Device", Applied Mechanics and Materials, Vols. 55-57, pp. 1468-1472, 2011
Online since
May 2011
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