Paper Title:
Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process
  Abstract

In the current study, a high precision polishing process test bench with in-situ measurement technology was developed. The test bench also adopted to investigate the effects of operating parameters on polishing interfacial phenomena during the polishing process with IC1000 pad. The experimental results coincide with the experimental and theoretical data published previously results. The developed test rig and the current experimental outcomes contribute to the understanding of soft pad polishing mechanism.

  Info
Periodical
Edited by
Qi Luo
Pages
508-511
DOI
10.4028/www.scientific.net/AMM.55-57.508
Citation
H. J. Tsai, P. Y. Huang, M. Y. Tsai, H. C. Tsai, C. J. Lin, "Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process", Applied Mechanics and Materials, Vols. 55-57, pp. 508-511, 2011
Online since
May 2011
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