Paper Title:
E-Beam Processing Technology and the Application in Micro-Hole Process
  Abstract

It is very difficult ot process the micro-deep hole, especially the hole made of hard guilder alloy, heat resisting alloy by classical machine method. The E-beam processes which make use of the high energy of e-beam can manufacture lots of micro-deep hole and abnormal shaped hole constituted of hard-transformed materials. The process of high-efficiency and high-definition can be obtained by selecting processing-parameters correctly and reasonably.

  Info
Periodical
Edited by
Qi Luo
Pages
647-651
DOI
10.4028/www.scientific.net/AMM.58-60.647
Citation
F. L. Hu, Y. L. Cheng, Z. He, "E-Beam Processing Technology and the Application in Micro-Hole Process", Applied Mechanics and Materials, Vols. 58-60, pp. 647-651, 2011
Online since
June 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yan Jin, Jian Jun Hu, Hong Bin Xu
Embedded System
Abstract:The electron beam polishing equipment technology is brought forward and its characteristic is explained because general processing method...
1555
Authors: Fatin Syazana Jamaludin, Mohd Faizul Mohd Sabri
Abstract:The aspect ratio of microholes milled on silicon by FIB/SEM milling was investigated with various beam currents and initial depths of mill....
436
Authors: Chen Ying Wang, Shu Ming Yang, Qi Jing Lin, Zhuang De Jiang
Chapter 2: Sensors, Measurement and Detection
Abstract:The accuracy and traceability of measurement at nano-scale are directly related to nano-fabrication. Nanostep is typical structure, so the...
842
Authors: Dong Hui Zhang, Chun Dong Liu, Landi Zhang, Zhan Ying Wang
Chapter 16: Laser Processing
Abstract:An experimental measuring method of flight trajectory of edge electron of the electron-beam in the electron gun of furnace was designed....
2388
Authors: Laura Stöber, Michael Schneider, Ulrich Schmid
3.1 Doping, Implantation and Contacts
Abstract:In this paper, we report on the performance of Ti/4H-SiC Schottky junctions, whereas the contact material is either e-beam evaporated or...
569