Paper Title:
In Situ Determination of Glass Transition Temperatures of Epoxy Adhesives in Structural Ceramic Assemblies
  Abstract

A method is described for measuring the glass transition temperature (Tg) of epoxy joints bonding ceramic (SiC) substrates. This method is based on the strain measure of a single-lap joint subjected to a temperature variation. The resulting displacement (d) is observed as a function of the temperature (T) by means of a contact strain gauge extensometer. Thus Tg value can be determined using (d-T) curves recorded. The influence of joint parameters (joint thickness and overlap length) and of other parameters such as the applied load and the surface state of substrates were studied for a structural epoxy adhesive showing different thermomechanical behaviours. The results show that it is possible, with appropriate experimental conditions, to measure Tg with this method and to find Tg values similar to those found by classical techniques such as the static thermomechanical analysis (TMA) and the differential scanning calorimetry (DSC). This method shows similarities with TMA, but it has the advantage to allow the thermomechanical analysis of adhesives without destructive sampling of joints.

  Info
Periodical
Edited by
Moussa Karama
Pages
107-116
DOI
10.4028/www.scientific.net/AMM.62.107
Citation
V. Nassiet, B. Hassoune-Rhabbour, Y. Baziard, "In Situ Determination of Glass Transition Temperatures of Epoxy Adhesives in Structural Ceramic Assemblies", Applied Mechanics and Materials, Vol. 62, pp. 107-116, 2011
Online since
June 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: A.M.G. Pinto, A.G. Magalhães, Raul D.S.G. Campilho, Marcelo F.S.F. de Moura, A.P.M. Baptista
Abstract:Polyolefins are especially difficult to bond due to their non-polar, non-porous and chemically inert surfaces. Acrylic adhesives used in...
1157
Authors: Jun Deng
Abstract:One of the greatest drawbacks to predicting the behaviour of bonded joints has been the lack of reliable data on the mechanical properties of...
814
Authors: Bao Wen Zhang, Jian Ping Lin, Zhi Guo Lu
Abstract:In the weld-through technique of weld-bonding process, adhesive usually suffers extremely high temperature, causing damage to adhesive and...
128
Authors: Jian Guang Zhang, Xiao Dong He
Chapter 13: Surface Engineering/Coatings
Abstract:Joining behavior of long glass fiber reinforced polypropylene (LFT) by three types of adhesive was investigated. Single-lap shear testing was...
1942
Authors: Xiao Cong He
Chapter 1: Materials and Technology
Abstract:This paper investigates normal stress distribution of a single-lap adhesively bonded joint under tension using the three-dimensional finite...
9