Paper Title:
Design of Multilayer Substrates Microstrip Patch Antenna for Fuze Application
  Abstract

A broadband microstrip patch antenna with multi-layer substrate for fuze application is designed. The multi-layer substrate is composed of the bottom layer of Si with low electric conductivity, the middle and the top layers of Si with high electric conductivity. An air cavity is fabricated by inductively coupled plasma (ICP) etching in the middle layer of Si to reduce the effective dielectric constant of the multi-layer substrate. The multi-layer substrate microstrip patch antenna is simulated and optimized by finite element method. The simulation results show that operating at 10GHz, the bandwidth and the gain of the multi-layer substrate microstrip patch antenna are 15.5% and 6.1dB respectively, which meet the needs of the application in fuze well.

  Info
Periodical
Edited by
Helen Zhang and David Jin
Pages
51-54
DOI
10.4028/www.scientific.net/AMM.63-64.51
Citation
T. Wang, L. X. Xu, Z. Z. Cui, "Design of Multilayer Substrates Microstrip Patch Antenna for Fuze Application", Applied Mechanics and Materials, Vols. 63-64, pp. 51-54, 2011
Online since
June 2011
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$32.00
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