Paper Title:
Study on Swelling Solution for High Tg Epoxy Resin Substrate
  Abstract

A new type of swelling solution is developed, which is applied for the pre-treatment of plating-through-hole (PTH) of print circuit board (PCB) made up of high Tg epoxy resin substrates. The results show that the best formula is 144 organic esters 200g/L and hexylene glycol 2g/L. The treatment temperature and processing time is 60°C and 6min, respectively. Under the optimal conditions, the residue caused by drilling can be removed completely through the process including swelling, oxidation and neutralization.

  Info
Periodical
Edited by
Honghua Tan
Pages
90-95
DOI
10.4028/www.scientific.net/AMM.66-68.90
Citation
G. F. Han, J. H. Shi, Z. D. Chen, "Study on Swelling Solution for High Tg Epoxy Resin Substrate", Applied Mechanics and Materials, Vols. 66-68, pp. 90-95, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Xun Zhu, Yun Yang Wei
Chapter 9: Green Chemical Process Technology
Abstract:The aldehydes and ketones can be reduced readily by NaBH4 without any modification. NaBH4 can not reduce esters and their derivatives under...
1936
Authors: Chun Zhi Zhang, Ming Chen, Zhi Guo Mao, Guo Ren Zu
Chapter 1: Chemical Engineering and Technologies
Abstract:A simple and inexpensive procedure involving ethanolysis and urea complexation was developed to concentrate docosahexaenoic acid (DHA) and...
54
Authors: Xiao Jun Hu, Ya Nan Chen, Qing Bian, Ming Chen, Wen Qin, Jing Feng
Chapter 1: Materials and Processing Technology
Abstract:Organosilicon-modified epoxy esters resin was successfully prepared by solution polymerization and the effect of content of silica sol and...
148