The determination of dynamic characteristics of microelectromechanical system (MEMS) devices is of great importance. Currently, vibrometer techniques using a Laser-Doppler Vibrometer (LDV) are used for dynamic measurement of MEMS, utilizing an interferometer based on a stroboscope and high-speed cine photomicrography are used for MEMS. But, these methods can’t be used for 3D dynamic displacement measurement simultaneously because of their limitations. In this paper, an optical system for 3D dynamic displacement measurement of micro-components is presented using stroboscopic fringe projection and digital image correlation (DIC), which can measure both in-plane and out-of-plane motions simultaneously. In the system, stroboscopic fringe patterns are projected onto the surface of a vibrating specimen by a phase-shifting projector and stroboscopic illumination supplied with a pulsed laser diode. Synchronization between the stroboscopic laser and the driving signal for the specimen vibrating is achieved by the stroboscopic controller. For a certain vibration state, four deformed phase-shifting fringe patterns are captured by a high-resolution CMOS camera with a long working distance microscope. The images are processed by a phase-shifting technique to obtain the phase distribution. The surface pattern of the specimen without fringes could be obtained by certain phase-shifting algorithms. When stroboscopic pulses are delayed, the stroboscopic phase is changed and another vibrating status could be captured in the same way. Comparing the phase distributions of these two states, the out-of-plane displacement is achieved, which is the displacement of the specimen between these two states. The in-plane displacement could be obtained from the surface pattern without fringes by DIC. Adjusting the phase delay of illumination by stroboscopic controller, the motions of the specimen in the whole vibration period can be obtained.