Paper Title:
Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers
  Abstract

In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.

  Info
Periodical
Edited by
R. L. Burguete, M. Lucas, E. A. Patterson, S. Quinn
Pages
399-404
DOI
10.4028/www.scientific.net/AMM.70.399
Citation
W. C. Wang, T. Y. Wu, "Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers", Applied Mechanics and Materials, Vol. 70, pp. 399-404, 2011
Online since
August 2011
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