Paper Title:
Thermal Analysis on the Crack of External Thermal Insulation System of XPS Board
  Abstract

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Periodical
Chapter
Chapter 4: Frontiers of Energy Engineering and Materials
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
2010-2016
DOI
10.4028/www.scientific.net/AMM.71-78.2010
Citation
X. Hu, C. W. Yan, "Thermal Analysis on the Crack of External Thermal Insulation System of XPS Board", Applied Mechanics and Materials, Vols. 71-78, pp. 2010-2016, 2011
Online since
July 2011
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$32.00
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