Paper Title:
Mechanical and Thermal Properties of PCM Wallboards Based on Gypsum and Paraffin
  Abstract

This paper studied on preparation, mechanical and thermal properties of two PCM wallboards made of gypsum and paraffin composite, PCM particles wallboard and PCM bag packed wallboard. Density, flexural and compressive strength and thermal conductivity of PCM particles wallboards deceased as PCM particles dosage increasing. Only PCM particles wallboard with PCM particles dosage 30% is suitable. Thermal comparison between PCM wallboards and pure gypsum wallboard shows that two PCM wallboards have better thermal properties and PCM wallboards can be used in building envelope to cut down building energy-consumption.

  Info
Periodical
Chapter
Chapter 6: Frontiers of Manufacturing and Design
Edited by
Dongye Sun, Wen-Pei Sung and Ran Chen
Pages
3553-3557
DOI
10.4028/www.scientific.net/AMM.71-78.3553
Citation
X. P. Wang, Z. Q. Shen, Y. Zhang, D. X. Li, "Mechanical and Thermal Properties of PCM Wallboards Based on Gypsum and Paraffin", Applied Mechanics and Materials, Vols. 71-78, pp. 3553-3557, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jan Fořt, Milena Pavlíková, Anton Trník, Zbyšek Pavlík
Chapter 1: Materials Science
Abstract:In order to decrease the energy consumption of buildings and keep the high thermal comfort of the indoor environment, new types of plasters...
3
Authors: Jan Fořt, Anton Trník, Zbyšek Pavlík
Abstract:The sustainability principles in building sector promote a development of new building materials and products directly designated for...
1