Paper Title:
Design of Ultra Low Temperature Pressure and Temperature Sensor Structure
  Abstract

In order to measure the pressure in the ultra-low temperature condition, the structure of ultra-low temperature piezoresistive pressure sensor is designed. Polysilicon nanometer thin film is used as a varistor according to its temperature and piezoresistive characteristics. The effect of the dimensions of silicon elastic membrane for the sensor sensitivity and the strain dimensions of the elastic membrane are analyzed, then layout position of resistances is arranged. The package structure of pressure sensor is designed. Meanwhile, a low-temperature sensor is designed to compensate the temperature influence to the pressure sensor.

  Info
Periodical
Chapter
Chapter 6: Functional Materials
Edited by
Linli Xu, Wenya Tian and Elwin Mao
Pages
693-697
DOI
10.4028/www.scientific.net/AMM.80-81.693
Citation
C. H. Ji, B. Z. Zhang, J. Zhang, X. H. Li, J. L. Liu, "Design of Ultra Low Temperature Pressure and Temperature Sensor Structure", Applied Mechanics and Materials, Vols. 80-81, pp. 693-697, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Zhi Min Xu, Wei Xu Zhang, Tie Jun Wang
Abstract:The objective of this work is to numerically investigate the elastoplastic behavior of closed-cell foams. Anisotropic geometry with...
301
Authors: Li Cheng Yang, Li Wei Ning, Jin Xiang Hu, Yi Ping Luo
Abstract:The three dimensional finite element model of the pavement has been built on the basis of elastic-plastic finite element method and the...
1380
Authors: Ke Zhong, Jing Hu, Bin Zheng
Chapter 1: Key Engineering Materials
Abstract:Firstly the pavement compound system model of steel beam and steel-concrete combined section are established based on structure...
103
Authors: Wen Liang Ma, Xin Li Bai
Chapter 2: Simulation and Engineering Optimization
Abstract:The force characteristic of Shahe prestressed U-shaped thin shell beam-supported aqueduct in operational process and stress or displacement...
455
Authors: Fang Qin Yang, Yang Fu Jin, Xin Qian
Chapter 2: Materials and Processing Technologies
Abstract:Heat conductive materials, which are widely used in the fields like electronic information, electrical engineering and aerospace, are...
523