Paper Title:
Bi-Layered Model of Interfacial Thermal Stresses with the Effect of Different Temperatures in the Layers
  Abstract

An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.

  Info
Periodical
Edited by
Ford Lumban Gaol, Mehdi Roopaei, Svetlana Perry and Jessica Xu
Pages
63-70
DOI
10.4028/www.scientific.net/AMM.87.63
Citation
S. Debnath, M. E. Rahman, W. D. Engida, M. V. V. Murthy, K.N. Seetharamu, "Bi-Layered Model of Interfacial Thermal Stresses with the Effect of Different Temperatures in the Layers", Applied Mechanics and Materials, Vol. 87, pp. 63-70, 2011
Online since
August 2011
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$32.00
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