Paper Title:
Bi-Layered Model of Interfacial Thermal Stresses with the Effect of Different Temperatures in the Layers
| Periodical | Applied Mechanics and Materials (Volume 87) |
|---|---|
| Main Theme | Applied Mechanics and Manufacturing Technology |
| Edited by | Ford Lumban Gaol, Mehdi Roopaei, Svetlana Perry and Jessica Xu |
| Pages | 63-70 |
| DOI | 10.4028/www.scientific.net/AMM.87.63 |
| Citation | Sujan Debnath et al., 2011, Applied Mechanics and Materials, 87, 63 |
| Online since | August, 2011 |
| Authors | Sujan Debnath, Muhammad Ekhlasur Rahman, Woldemichael Dereje Engida, M. V. V. Murthy, K. N. Seetharamu |
| Keywords | Different Uniform Temperature Model, Linear Temperature Gradient Model, Peel Stress, Shearing Stress |
| Price | US$ 28,- |
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Abstract
An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.
