Paper Title:
Influence of Testing Temperature on the Weibull Modulus of Post-Hipped α-SiC
  Abstract

  Info
Periodical
Edited by
M. Zahir
Pages
249-256
DOI
10.4028/www.scientific.net/AMR.1-2.249
Citation
F. Osterstock, A. Charif, "Influence of Testing Temperature on the Weibull Modulus of Post-Hipped α-SiC ", Advanced Materials Research, Vols. 1-2, pp. 249-256, 1994
Online since
September 1994
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Price
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