Paper Title:
Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process
  Abstract

This paper analyses the kinetic trajectory of abrasives both in initiative driving mode and passive driving mode, and the uniformity of lapping trajectory of the two opposite drive modes is discussed, respectively. The imperative relation between the kinematic trajectory and the uniformity is researched in this paper, as well as the simulation of the lapping trajectory.

  Info
Periodical
Advanced Materials Research (Volumes 102-104)
Edited by
Guozhong Chai, Congda Lu and Donghui Wen
Pages
555-558
DOI
10.4028/www.scientific.net/AMR.102-104.555
Citation
P. F. Gao, W. F. Wang, D. H. Wen, "Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process", Advanced Materials Research, Vols. 102-104, pp. 555-558, 2010
Online since
March 2010
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Price
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