Paper Title:
Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates
  Abstract

This paper proposed a new approach to control the micro-quality of sapphire substrate, in order to grow GaN on substrate. The main factors that influence macro-quality are the method of slicing, grinding and polishing. Thread speed of slicing is less than 0.5m/s. Ductile mode grinding of substrate is achieved by #3000 diamond wheel and feed of 1μm/r. The suitable polishing conditions are that the SiO2 grain size is less than 10nm, the concentration SiO2 is 3%, pH value of polishing liquid is 10.5 and polishing stress is 190Pa. The undamaged substrates have been obtained steadily. The surface roughness RMS is less than 0.4 nm.

  Info
Periodical
Advanced Materials Research (Volumes 102-104)
Edited by
Guozhong Chai, Congda Lu and Donghui Wen
Pages
738-741
DOI
10.4028/www.scientific.net/AMR.102-104.738
Citation
H. Zhou, L. G. Bai, D. P. Wang, "Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates", Advanced Materials Research, Vols. 102-104, pp. 738-741, 2010
Online since
March 2010
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Price
$32.00
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