Paper Title:
Interfacial Microstructure and Strength of Vacuum Brazed Joints of Ternary Ceramics Ti3SiC2
  Abstract

Ti3SiC2 is one of the nano-layered ternary ceramics Mn+1AXn, where M is a transition metal, A is an A-group (mostly IIIA or IVA) element, and X is C or N. With the filler of Ag-Cu-Ti, the brazing of Ti3SiC2 has been conducted at 800°C–950°C for 5-10min under 3.5×103Pa in a vacuum. The phase composition and microstructure of the joints were investigated by XRD, SEM AND EPMA. The diffusion of Cu element in fillers through the reaction zone toward Ti3SiC2 is the main controlling step in the bonding process. Joint strengths were evaluated by three point bending test. The maximum flexural strength of joints reaches is 306±11MPa, which is lower than the bending strength of Ti3SiC2, obtained under the same condition.

  Info
Periodical
Advanced Materials Research (Volumes 105-106)
Edited by
Wei Pan and Jianghong Gong
Pages
226-229
DOI
10.4028/www.scientific.net/AMR.105-106.226
Citation
L. P. Shi, Y. S. Zhong, J. Yu, X. D. He, "Interfacial Microstructure and Strength of Vacuum Brazed Joints of Ternary Ceramics Ti3SiC2 ", Advanced Materials Research, Vols. 105-106, pp. 226-229, 2010
Online since
April 2010
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Min Yang, Zeng Da Zou, Si Li Song, Xin Hong Wang
Abstract:In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum...
2435
Authors: Young Sup Lee, Cheol Ho Lim, C.H. Lee, K.W. Seo, Seung Y. Shin, Chang Hee Lee
Abstract:In this study, a diffusion bonding of aluminium alloy A6061 was preformed using an Ag-28Cu filler metal in order to conduct eutectic...
2772
Authors: José Lemus-Ruiz, Ana L. Salas-Villaseñor, Osvaldo Flores
Abstract:Solid-state direct diffusion bonding between commercially pure nickel and tungsten carbide (with 6%Cobalt) has been carried out in the...
127
Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
Chapter 1: Materials Engineering. Technologies and Processing
Abstract:Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and...
44
Authors: Lu Chai, Li Wang, Ji Hua Huang, Jin Bao Hou, Bo Lang, Hao Yang
Chapter 1: Materials Science and Technology
Abstract:N5 single crystal was transient liquid phase (TLP) diffusion bonded under different conditions in vacuum environment using Ni-base insert...
77