Paper Title:
Thermal Shock Testing of Ceramics for Circuit Substrates
  Abstract

Thermal shock resistances of commercially available aluminum nitride and alumina ceramics as used for the circuit substrate were evaluated by infrared radiation heating (IRH) technique. Thermal shock fracture toughness, R2c of these materials was estimated experimentally and theoretically using IRH technique at various ambient temperatures. Temperature dependence of thermal properties of the materials was taken into account for the temperature and the thermal stress analysis. Experimental values of thermal shock fracture toughness were in good agreement with the calculated values. Thermal shock fracture toughness decreased with elevated ambient temperature in both ceramics.

  Info
Periodical
Advanced Materials Research (Volumes 11-12)
Main Theme
Edited by
Masayuki Nogami, Riguang Jin, Toshihiro Kasuga and Wantai Yang
Pages
31-34
DOI
10.4028/www.scientific.net/AMR.11-12.31
Citation
S. Honda, S. Hashimoto, H. Awaji, "Thermal Shock Testing of Ceramics for Circuit Substrates", Advanced Materials Research, Vols. 11-12, pp. 31-34, 2006
Online since
February 2006
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Price
$32.00
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