Thermal Shock Test for Porous Ceramics Using Water Flow Cooling Method |
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| Journal | Advanced Materials Research (Volumes 11 - 12) |
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| Volume | AICAM 2005 |
| Edited by | Masayuki Nogami, Riguang Jin, Toshihiro Kasuga and Wantai Yang |
| Pages | 35-38 |
| DOI | 10.4028/www.scientific.net/AMR.11-12.35 |
| Citation | Cheng Ji Xian et al., 2006, Advanced Materials Research, 11-12, 35 |
| Online since | February, 2006 |
| Authors | Cheng Ji Xian, Hideo Awaji |
| Keywords | Porous SiC, Temperature Distribution, Thermal Shock Test, Thermal Stress, Water Flow Cooling |
| Abstract | Thermal shock test for porous SiC ceramics heated up to testing temperature was performed by a water flow cooling method. In order to find the influence of the penetration for the porous material under the thermal shock, transient temperature distribution was simulated with taking account of the infiltration of the cooling media into the specimen. Thermal stress distributions in the specimens were also calculated from the estimated temperature distributions. In this study, it was evident that the temperature variation of the porous ceramics was more rapid than that of the ceramics without taking account of the penetration. |
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