Microstructure Analysis of TaN/Cu Nanocomposite Coatings Deposited by Pulsed DC Magnetron Sputtering |
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| Journal | Advanced Materials Research (Volumes 123 - 125) |
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| Volume | Multi-Functional Materials and Structures III |
| Edited by | Joong Hee Lee |
| Pages | 427-430 |
| DOI | 10.4028/www.scientific.net/AMR.123-125.427 |
| Citation | T. Elangovan et al., 2010, Advanced Materials Research, 123-125, 427 |
| Online since | August, 2010 |
| Authors | T. Elangovan, D. Mangalaraj, K. Prabakar, P. Kuppusami, Shabana Khan, E. Mohandas |
| Keywords | Magnetron Sputtering, Nanocomposite Film, Scanning Electron Microscope (SEM), Tantalum Nitride, TEM |
| Abstract | TaN-Cu nanocomposite thin films used as materials for thin-film resistors (TFR) were prepared by magnetron pulsed dc reactive sputtering. Structural and morphological properties of films deposited on (100) Si as a function of nitrogen flow rate and substrate temperature is investigated. With the introduction of N2 gas flow indicated with different phases of nanocrystalline h-Ta, Ta2N, TaN, Ta4N5 and Cu. XRD analysis of the films deposited with increasing substrate temperature at constant flow rate of nitrogen 10 sccm indicated that the nanocrystalline with bi-phasic (fcc-TaN and fcc-Cu). The microstructure of the films was investigated by scanning electron microscopy and high-resolution transmission electron microscopy. |
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