Paper Title:
Thermal Resistivity Properties of LED Packages with Thermal via
  Abstract

The LED chips, packages and related materials have been already key issue on electronic applications and substitution of conventional lights. It is easily expected that the development trend of LED products is nearly the same as that of electronic products with higher performance, higher integration, lower energy and lower cost. And then we also prospect that the dissipated heat from LED chip is to be big problem for a reliability of products, as likely that electronic packages contain heat sink or heat spreader for controlling heat dissipation. In fact, the heat from an LED package with 1~3W LED chip shows a nearly 60~150°C, which affects thermal damage related to performance, joint failure, crack, etc. The thermal via was fabricated with 16 segments of via sizes ranged 0.2~1.2mm and via pitches ranged 0.5~3mm using 1~3W LED, respectively. The thermal resistivity was analyzed by the thermal transient tester with the variation of via sizes and pitches, which was also compared with the temperature difference of the top and bottom side of LED package. As a results, we convincingly proved the relationships between the design of thermal via and the heat dissipation of LED module, which were directly applicable to LED industry.

  Info
Periodical
Advanced Materials Research (Volumes 123-125)
Edited by
Joong Hee Lee
Pages
511-514
DOI
10.4028/www.scientific.net/AMR.123-125.511
Citation
H. S. Lee, H. W. Shin, S. B. Jung, "Thermal Resistivity Properties of LED Packages with Thermal via", Advanced Materials Research, Vols. 123-125, pp. 511-514, 2010
Online since
August 2010
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Price
$32.00
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